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november 2009 ? 2009 fairchild semiconductor corporation www.fairchildsemi.com FPF1103 / fpf1104 ? rev. 1.0.1 FPF1103 / fpf1104 ? advance load management switch FPF1103 / fpf1104 advance load management switch features ? 1.2v to 4v input voltage operating range ? typical r ds(on) : - 35m ? at v in =3.3v - 55m ? at v in =1.8v - 85m ? at v in =1.2v ? slew rate control with t r : 65s ? output discharge function on fpf1104 ? low <1a quiescent current at v on =v in ? esd protected: above 4000v hbm, 2000v cdm ? gpio/cmos-compatible enable circuitry applications ? mobile devices and smart phones ? portable media devices ? digital cameras ? advanced notebook, umpc, mid ? portable medical devices ? gps and navigation equipment description the FPF1103/04 are low r ds p-channel mosfet load switches of the intellimax? family. integrated slew-rate control prevents inrush current from glitch supply rails with capacitive loads common in power applications. the input voltage range operates from 1.2v to 4v to fulfill today's lowest ultra-portable device supply requirements. switch control is by a logic input (on-pin) capable of interfacing directly with low-voltage cmos control signals and gpios in embedded processors. ordering information part number part marking switch (typical) at 1.8v in input buffer output discharge on pin activity t r eco status package FPF1103 q9 55m ? cmos na active high 65s green 4-ball, wafer-level chip- scale package (wlcsp), 1.0 x 1.0mm, 0.5mm pitch fpf1104 qa 55m ? cmos 65 ? active high 65s green for fairchild?s definition of eco status, please visit: http://www.fairchildsemi.com/com pany/green/rohs_green.html .
? 2009 fairchild semiconductor corporation www.fairchildsemi.com FPF1103 / fpf1104 ? rev. 1.0.1 2 FPF1103 / fpf1104 ? advance load management switch application diagram FPF1103/fpf1104 v in gnd v out on off on c in c out to load figure 1. typical application notes: 1. c in =1 f, x5r, 0603, for example murata grm185r60j105ke26 2. c out =1 f, x5r, 0805, for example murata grm216r61a105ka01 block diagram FPF1103/4 figure 2. block diagram (output discharge for fpf1104 only)
? 2009 fairchild semiconductor corporation www.fairchildsemi.com FPF1103 / fpf1104 ? rev. 1.0.1 3 FPF1103 / fpf1104 ? advance load management switch pin configurations figure 3. 1 x 1mm wlcsp bumps facing down figure 4. 1 x 1mm wlcsp bumps facing up a 1 a 2 b1 b2 v out on v in gnd a 2 a 1 b2 b1 v in gnd v out on figure 5. pin assignments (top view) figure 6. pin assignments (bottom view) pin definitions pin # name description a1 v out switch output a2 v in supply input: input to the power switch b1 gnd ground b2 on on/off control, active high
? 2009 fairchild semiconductor corporation www.fairchildsemi.com FPF1103 / fpf1104 ? rev. 1.0.1 4 FPF1103 / fpf1104 ? advance load management switch absolute maximum ratings stresses exceeding the absolute maximum ratings may damage the device. the device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. in addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. the absolute maximum ratings are stress ratings only. symbol parameter min. max. unit v in v in , v out , v on to gnd -0.3 4.2 v i sw maximum continuous switch current 1.2 a p d power dissipation at t a =25c 1.0 w t stg storage junction temperature -65 +150 c t a operating temperature range -40 +85 c ja thermal resistance, junction-to-ambient 1s2p with 1 thermal via 95 c/w 1s2p without thermal via 187 esd electrostatic discharge capability human body model, jesd22-a114 4 kv charged device model, jesd22-c101 2 recommended operating conditions the recommended operating conditions table defines the conditions for actual device operation. recommended operating conditions are specified to ens ure optimal performance to the datasheet specifications. fairchild does not recommend exceeding them or designing to absolute maximum ratings. symbol parameter min. max. unit v in supply voltage 1.2 4.0 v t a ambient operating temperature -40 +85 c
? 2009 fairchild semiconductor corporation www.fairchildsemi.com FPF1103 / fpf1104 ? rev. 1.0.1 5 FPF1103 / fpf1104 ? advance load management switch electrical characteristics unless otherwise noted, v in =1.2 to 4.0v, t a =-40 to +85c; typical values are at v in =3.3v and t a =25c. symbol parameter conditions min. typ. max. units basic operation v in supply voltage 1.2 4.0 v i q(off) off supply current v on =gnd, v out =open, v in =4v 1 a i sd(off) off switch current v on =gnd, v out =gnd 1 a i q quiescent current i out =0ma, v on =v in 1 a i out =0ma, v on < v in 3 r on on-resistance v in =3.3v, i out =200ma, t a =25c 35 50 m ? v in =1.8v, i out =200ma, t a =25c 55 70 v in =1.5v, i out =200ma, t a =25c 70 v in =1.2v, i out =200ma, t a =25c 85 150 v in =1.8v, i out =200ma, t a =85c (3) 65 100 r pd output discharge r pull down v in =3.3v, v on =0v, i force =20ma, t a =25c, fpf1104 65 110 ? v ih on input logic high voltage v in =1.2v to 4.0v 1.1 v v il on input logic low voltage v in =1.2v to 4.0v 0.35 v i on on input leakage v on =v in or gnd -1 1 a dynamic characteristics t don turn-on delay (4) v in =3.3v, r l =10 ? , c l =0.1f, t a =25c 35 s t r v out rise time (4) 65 s t on turn-on time (4,6) 100 s t don turn-on delay (4) v in =3.3v, r l =500 ? , c l =0.1f, t a =25c 30 50 s t r v out rise time (4) 40 55 s t on turn-on time (4,6) 70 105 s FPF1103 t doff turn-off delay (4) v in =3.3v, r l =10 ? , c l =0.1f, t a =25c 2.0 2.5 s t f v out fall time (4) 2.2 s t off turn-off (4,7) 4.2 s t doff turn-off delay (4) v in =3.3v, r l =500 ? , c l =0.1f, t a =25c 7.0 s t f v out fall time (4) 110 s t off turn-off (4,7) 117 s fpf1104 (5) t doff turn-off delay (4) v in =3.3v, r l =10 ? , c l =0.1f, r pd =65 ? , t a =25c 2.0 2.5 s t f v out fall time (4) 1.9 s t off turn-off (4,7) 3.9 s t doff turn-off delay (4) v in =3.3v, r l =500 ? , c l =0.1f, r pd =65 ? , t a =25c 2.5 s t f v out fall time (4) 10.6 s t off turn-off (4,7) 13.1 s notes: 3. this parameter is guaranteed by design and characterization; not production tested. 4. t don /t doff /t r /t f are defined in figure 7. 5. output discharge path is enabled during off.
? 2009 fairchild semiconductor corporation www.fairchildsemi.com FPF1103 / fpf1104 ? rev. 1.0.1 6 FPF1103 / fpf1104 ? advance load management switch timing diagram 10% v on v out v out t don t doff 10% 3.3v 90% t f 90% t r 90% 10% 50% 50% notes: 6. t on =t r + t don . 7. t off =t f + t doff . figure 7. timing diagram
? 2009 fairchild semiconductor corporation www.fairchildsemi.com FPF1103 / fpf1104 ? rev. 1.0.1 7 FPF1103 / fpf1104 ? advance load management switch typical performance characteristics 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -40 -15 10 35 60 85 t j , junction temperature (c) v in shutdown current ( a) v in = 4.0v v in = 1.2v v in = 3.3v v on = v out = 0v figure 8. shutdown current vs. temperature figure 9. shutdown current vs. supply voltage 0.00 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.10 -40 -15 10 35 60 85 t j , junction temperature (c) off supply current ( a) v on = 0v v in = 4.0v v in = 1.2v v in = 3.3v 0.00 0.01 0.02 0.03 0.04 0.05 0.06 0.07 1.01.52.02.53.03.54.0 supply voltage (v) off supply current ( v on = 0v 25c 85c -40c figure 10. off supply current vs. temperature (FPF1103, v out is floating) figure 11. off supply current vs. supply voltage (FPF1103, v out is floating) 0.000 0.005 0.010 0.015 0.020 0.025 0.030 0.035 0.040 0.045 0.050 -40 -15 10 35 60 85 t j , junction temperature (c) supply current ( v on = v in v in = 4.0v v in = 1.2v v in = 3.3v 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 1.01.52.02.53.03.54.0 supply voltage (v) supply current ( 25c 85c -40c v on = v in figure 12. quiescent current vs. temperature (v on =v in ) figure 13. quiescent current vs. supply voltage 0.00 0.05 0.10 0.15 0.20 0.25 1.0 1.5 2.0 2.5 3.0 3.5 4.0 supply voltage (v) v in shutdown current ( a) 25c 85c -40c v on =v out =0v
? 2009 fairchild semiconductor corporation www.fairchildsemi.com FPF1103 / fpf1104 ? rev. 1.0.1 8 FPF1103 / fpf1104 ? advance load management switch typical performance characteristics 0.00 0.50 1.00 1.50 2.00 2.50 3.00 -40 -15 10 35 60 85 t j , junction temperature (c) supply current ( v on = 0.75 x v in v in = 4.0v v in = 1.2v v in = 3.3v 0.00 0.50 1.00 1.50 2.00 2.50 1.0 1.5 2.0 2.5 3.0 3.5 4.0 supply current(a) supply voltage (v) +85c +25c -40c figure 14. quiescent current vs. temperature (v on =0.75 x v in ) figure 15. quiescent current vs. supply voltage at v on =1.2v 0 20 40 60 80 100 120 -40 -15 10 35 60 85 t j , junction temperature (c) on resistance (m ) v on = v in i out = 200ma v in = 4.0v v in = 1.2v v in = 3.3v 0 50 100 150 200 250 300 1.0 1.5 2.0 2.5 3.0 3.5 4.0 supply voltage (v) on resistance (m ) 25c 85c -40c v on =v in i out =200ma figure 16. r on vs. temperature figure 17. r on vs. supply voltage 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 1.0 1.5 2.0 2.5 3.0 3.5 4.0 supp l y v o ltage ( v ) v on input logic voltage (v) v ih v il figure 18. on-pin threshold vs. v in
? 2009 fairchild semiconductor corporation www.fairchildsemi.com FPF1103 / fpf1104 ? rev. 1.0.1 9 FPF1103 / fpf1104 ? advance load management switch typical performance characteristics 1 1 10 - - 151368 t j jun c t io n t empera t ure ( c ) rise/fall t ime ( s) t t v in =3.3 c l = 0.1 r l = 10 r f 1 10 100 -40 -1 5 10 35 60 85 t j junc t i o n t emper a t ure (c) on/off delay time (s) t doff t don v i n = 3 . 3 c l =0. 1 f r l =10 figure 19. v out rise and fall time vs. temperature at r l =10 figure 20. v out turn-on and turn-off delay vs. temperature at r l =10 0 10 20 30 4 0 50 60 -40 -1 5 10 35 60 85 t j junc t i o n t empe r a t ure ( c ) rise/fall t ime ( s) t r t v in = 3 . 3 c l = 0 . 1 f r = 50 0 f 0 10 20 30 40 50 60 -40 -50 10 35 60 8 5 t j jun c t io n t empera t ure ( c ) on/off delay time (s) t doff t don v i n = 3.3 c l = 0.1f r l = 500 figure 21. v out rise and fall time vs. temperature at r l =500 figure 22. v out turn-on and turn-off delay vs. temperature at r l =500 0 10 20 30 40 50 60 70 80 90 10 100 1000 rise/dela y time ( s) r load output load ( ) t r t don figure 23. t r /t don vs. output load at v in =3.3v
? 2009 fairchild semiconductor corporation www.fairchildsemi.com FPF1103 / fpf1104 ? rev. 1.0.1 10 FPF1103 / fpf1104 ? advance load management switch typical performance characteristics figure 24. turn-on response (v in =3.3v, c in =1f, c out =0.1f, r l =10 ? ) figure 25. turn-off response (v in =3.3v, c in =1f, c out =0.1f, r l =10 ? ) figure 26. turn-on response (v in =3.3v, c in =1f, c out =0.1f, r l =500 ? ) figure 27. turn-off response (v in =3.3v, c in =1f, c out =0.1f, r l =500 ? )
? 2009 fairchild semiconductor corporation www.fairchildsemi.com FPF1103 / fpf1104 ? rev. 1.0.1 11 FPF1103 / fpf1104 ? advance load management switch application information input capacitor an intellimax tm switch doesn?t require an input capacitor. to reduce device inrush current effect, a 0.1f ceramic capacitor, c in , is recommended close to the vin pin. a higher value of c in can be used to further reduce the voltage drop experienced as the switch is turned on into a large capacitive load. output capacitor an intellimax tm switch works without an output capacitor. however, if paras itic board inductance forces v out below gnd when switching off, a 0.1f capacitor, c out , should be placed between v out and gnd. fall time device output fall time can be calculated based on rc constant of the external components as follows: 2 . 2 c r t l l f = (1) where t f is 90% to 10% fall time, r l is output load, and c l is output capacitor. the same equation works for a device with a pull-down output resistor. r l is replaced by a parallel connected pull-down and an external output resistor combination, as follows: 2 . 2 c r r r r t l pd l pd l f + = (2) where t f is 90% to 10% fall time, r l is output load, r pd =65 .is output pull-down resistor, and c l is the output capacitor. resistive output load if resistive output load is missing, the intellimax tm switch without a pull-down output resistor is not discharging the output voltage. output voltage drop depends, in that case, mainly on external device leaks.
? 2009 fairchild semiconductor corporation www.fairchildsemi.com FPF1103 / fpf1104 ? rev. 1.0.1 12 FPF1103 / fpf1104 ? advance load management switch recommended land patte rn and layout for best thermal performance and minimal inductance and parasitic effects, it is recommended to keep input and output traces short and capacitors as close to the device as possible. below is a recommended layout for this device to achieve optimum performance. figure 28. recommended land pattern and layout
? 2009 fairchild semiconductor corporation www.fairchildsemi.com FPF1103 / fpf1104 ? rev. 1.0.1 13 FPF1103 / fpf1104 ? advance load management switch physical dimensions figure 29. 4 ball, 1.0 x 1.0mm wafer-level chip-scale packaging (wlcsp) product-specific dimensions product d e x y FPF1103 960m 30m 960m 30m 0.230mm 0.230mm fpf1104 960um 30m 960um 30m 0.230mm 0.230mm package drawings are provided as a service to customers considering fairchild components. drawings may change in any manner without notice. please note the revision and/or date on the drawing and contact a fairchild semiconductor representative to ver ify or obtain the most recent revision. package specifications do not expand the terms of fairchild?s worldwide terms and condition s, specifically the warranty therein, which covers fairchild products. always visit fairchild semiconductor?s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ .
? 2009 fairchild semiconductor corporation www.fairchildsemi.com FPF1103 / fpf1104 ? rev. 1.0.1 14 FPF1103 / fpf1104 ? advance load management switch

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